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Hexagonal Boron Nitride (II)

Executive standard: Q/TY. J08.34-2023
CAS NO. 10043-11-5
English alias: Boron Nitride, White Graphite
English abbreviation: HBN
Chinese alias: 六方氮化硼;白石墨;高温氮化硼

Product parameters

Executive standard: Q/TY. J08.34-2023

Chinese alias: 白石墨;一氮化硼

English alias: Boron Nitride, White Graphite

CAS RN: 10043-11-5

1. Physical and chemical properties:

1.1 Molecular formula: BN

1.2 Molecular weight: 24.81(on 1979 international atom weight)

1.3 Structure formula:

Structure formula

1.4 Melting point: 3000℃(stable in the inert atmosphere)

1.5 Mohs′ hardness: 1-2.

1.6 Density: 2.29g/cm3

1.7 Solubility: Insoluble in water, slightly soluble in hot acid.

1.8 Properties: Hexa-boron nitride has excellent electrical properties of electrical insulating, thermal conductivity, corrosion resistance and good lubrication. It has the strong ability of neutron absorption. With chemical properties of stability, it has corrosion resistance to various inorganic acids, alkali, salt solutions and organic solvents. So does all melting metals. Physical and chemical properties unchanged under 1000℃. The temperature can reach 3000℃ when used in nitrogen and argon. Hexagonal boron nitride powder is sintered by hot pressing into a white block, easy to machine, and the thermal resistance can be as high as 2000℃.

2. Technical indexes:

BN, %(m/m) ≥98.5 ≥98.5 ≥99.0 ≥99.0 ≥99.0 ≥99.0 ≥99.0 ≥99.0
B2O3, %(m/m) ≤0.5 ≤0.5 ≤0.3 ≤0.3 ≤0.3 ≤0.3 ≤0.3 ≤0.3
Particle size(D50), μm ≤4 5-7 8-12 13-16 17-22 23-26 ≥27 Test value
Appearance White powder

Nanoparticle HBN can be customized

3. Application:

H-BN-A, B, C: Medium crystallization, excellent high temperature resistance and oxidation resistance, its original particle size is small, agglomeration particle size is large. Because the particles are spherical, so it is particularly suitable for filler, mold release agent for casting and injection process. also easy to hot press molding.

H-BN-D: Tight distribution of particle size; Because its particle size is similar to PTFE, the particle size is uniform, so it is particularly suitable for high-pressure switch nozzles; Superior thermal conductivity, it is very suitable for thermal conductive plastic or thermal conductive rubber; Low oxygen content (generally less than 0.5%) is also particularly suitable as a raw material for special ceramics.

H-BN-E, H-BN-E1, H-BN-G: High crystallinity and tight distribution of particle size. Compared to other products, it is higher crystallinity and better properties of thermal conductivity, insulation, lubrication, high temperature resistance and resistance to corrosion from molten metal. It can be used in various high-end fields, including cosmetics and thermally conductive materials. Replacement of other expensive HBN products.

H-BN-F: High thermal conductivity, electrical insulation, low dielectric constant, low expansion coefficient, and good stability, so it is often used as an additive in the high-end electronics industry. Currently, other application areas of this product are being developed.

Use: electronics cooling fillers, ceramic sintering, mold release agent, protective coatings and sheaths, lubricant additives, cosmetics fillers.

4. Safety instructions: Physically inert, but boron nitride powder is harmful by ingestion, inhalation, eye and skin contact, which may cause skin, respiratory system, liver, kidney and the circulatory system damage. Be handled with rubber gloves, a respirator and eye protection.

5 Packing: Aluminum foil bag lined with plastic bag, net weight 1 kg/bag.

6. Storage: Store at cool, dry and ventilate. The shelf life is 36 months after manufacturer date. It is still available if retest result is qualified after expire date

7. Transportation: Avoid water, sun exposure and violent collision .Do not transport with strong oxidizers.


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