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5 micron high-temperature boron nitride to be dissolved in the glue (to improve thermal conductivity)

2020-11-27 17:43:36 

Q: The customer used 3 micron and 5 micron high-temperature boron nitride to be dissolved in the glue (to improve thermal conductivity), but a small amount of boron nitride was not dispersed. The customer would like to ask how can the agglomeration be dispersed?
A: It should be possible to separate with a high-speed mixer. Extension of time.

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